Cooler ThermoLab BARAM for CPU with TDP of up to 250 W
April 19, 2009, 7:12 pm
The company ThermoLab Co. announced release of a new passive cooling system for central processing units in the performance of Socket LGA775/LGA1366 (Intel) and Socket AM2/AM2 (AMD), characterized by levels of up to 250 W TDP. Model ThermoLab BARAM especially notable for the special arrangement of its existing presence in the five U-shaped copper heat pipes, as well as the special structure of its massive aluminum radiator, all of which greatly increases the effectiveness of diversion of surplus heat from warm during of the chip. It is also worth noting that if you want on a product you can add 120-mm fan, and thus to further enhance its performance. As for the dimensions and weight of new items, they will be 160 x 132 x 67 mm and 625 g respectively. Here is yet not known exactly when and for what price this product is available for sale.